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G07100 - SEMI G71 - パッケージング材料の中間容器のバーコードマーキングの仕様 Revision:SEMI G71-0996 (Reapproved 0811) - Superseded This document provides a method
G07100 - SEMI G71 - パッケージング材料の中間容器のバーコードマーキングの仕様 Revision:SEMI G71-0996 (Reapproved 0811) - Superseded This document provides a method
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Description
This document provides a method to measure etch pit density (EPD) in low dislocation density GaAs wafers
These test methods have not been tested on layered structures
The maximum number of tape frame wafers of both metal (SEMI G74) and plastic (SEMI G87) stored in the container shall be 13
SEMI M20-0215 (Reapproved 0421)
G07100 - SEMI G71 - パッケージング材料の中間容器のバーコードマーキングの仕様 Revision:SEMI G71-0996 (Reapproved 0811) - Superseded This document provides a methodglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
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 - Superseded This document provides a method){kind=link}