3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass StdTpc-Documentation/Training The SEMI E5 (SECS-II) Standard

The SEMI E5 (SECS-II) Standard provides the definition of messages and related data items exchanged between host and equipment

背景および動機付け

if it exists

SEMI E109-0703 (technical revision)

3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass StdTpc-Documentation/Training The SEMI E5 (SECS-II) Standard1 Purpose 1. 1 Through glass vias is an emerging technology in the semiconductor industry. Definitions for openings in glass have been described in SEMI 3D11, and a specification for glass as substrate for semiconductor applications with or without openings has been laid out in SEMI 3D16. However, there are few or no agreed upon test methods for measuring the physical and dimensional properties of through glass vias or other openings in glass or the